Making It Possible With Thin-Film Encapsulation (TFE) Market

Making It Possible With Thin-Film Encapsulation (TFE) Market

If you recently bought a phone, you must have read a feature called “AMOLED display” This is nothing but a technology where a thin film layer is used to protect the screen from ingress water and oxygen from the atmosphere. We are talking about the saviour- The thin film encapsulation. This film enables stronger, lighter, and more flexible AMOLED devices. Let us take a closer look at this enchanting thin-film encapsulation (TFE) market and its current state.

The thin-film encapsulation (TFE) market was valued at USD 100.27 million in 2023 and is expected to grow at a CAGR of 15.60%, generating a revenue of USD 369.69 million by 2032.

Lucrative Growth Opportunities Created for the Market

  • The Thin-Film Encapsulation (TFE) market has experienced significant growth recently.
  • The demand for flexible displays and improved protection against moisture and oxygen is driving this growth.
  • TFE is essential for the longevity and reliability of smartphones and wearable devices.
  • TFE acts as a protective barrier against moisture, gases, and dust particles.
  • It enhances device performance, image quality, and lifespan.
  • Manufacturers and consumers are attracted to the benefits of TFE.
  • The demand for OLED displays has contributed to the increased need for TFE.
  • OLED displays offer superior image quality and energy efficiency.
  • TFE enables flexible and foldable designs without compromising display performance.

Types of Deposition

TFE is achieved through various deposition methods, each with its advantages and applications. The most commonly used deposition techniques are as follows:

  • Inorganic Layer Deposition

Inorganic layer deposition refers to the process of depositing thin films composed of inorganic materials onto a substrate. This technique involves the controlled deposition of inorganic compounds such as oxides, nitrides, and metals onto a surface. Inorganic layer deposition methods include physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD).

  • Organic Layer Deposition

Organic layer deposition involves the deposition of thin films composed of organic materials onto a substrate. This technique utilizes various methods such as spin coating, dip coating, and vapor deposition to create organic layers with controlled thickness and properties. Organic layers consist of carbon-based compounds and polymers, offering unique properties such as flexibility, lightness, and electrical conductivity.

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Recent Developments

  • Ergis introduced Ergis noDiffusion, a new OLED encapsulation film platform, in August 2021. It is currently undergoing customer site testing in Asia, EU, and the US. The company plans to expand the platform to protect quantum dot films in lighting applications and displays.
  • Beneq introduced two new solutions in December 2021: Transform 300 and Prodigy. Transform 300 addresses the growing demand for semiconductor applications at 300 mm, providing versatility for CMOS image sensors, power devices, micro-OLED, and advanced packaging.

Summing It Up

As consumers continue to seek more durable and efficient electronic devices, thin-film encapsulation will play a pivotal role in meeting their expectations. Manufacturers and researchers are investing in R&D efforts to develop advanced materials and deposition methods, further driving innovation in the thin-film encapsulation (TFE) market. With the potential to transform the future of consumer electronics, Thin-Film Encapsulation is undoubtedly an exciting trend to watch out for.

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