Semiconductor Assembly and Packaging Equipment Market Size Worth USD 8.48 Billion by 2034 | CAGR: 8.92%

The semiconductor Assembly and Packaging Equipment market size is expected to reach USD 8.48 billion by 2034, according to a new study by Polaris Market Research. The report “Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region; Market Forecast, 2025–2034” gives a detailed insight into current market dynamics and provides analysis on future market growth.

Semiconductor assembly and packaging equipment refers to precision machinery used in the final stages of semiconductor manufacturing, where individual chips are connected, protected, and prepared for integration into electronic systems. This market is driven by the rapid evolution of flexible packaging techniques that aim to enhance chip performance, power efficiency, and miniaturization. The adoption of technologies such as 2.5D/3D integration and system-in-package is accelerating as end-use applications demand greater functionality in smaller form factors, driving equipment manufacturers to innovate and expand their capabilities to meet these complex packaging requirements.

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The increasing automation and digitalization of assembly and packaging processes further drive demand for semiconductor assembly and packaging equipment. Companies are investing in intelligent, high-throughput equipment that supports precise alignment, real-time monitoring, and data-driven optimization as semiconductor manufacturing continues to grow in complexity and scale. This shift enhances production efficiency and yield while also aligning with the industry's transition toward smart manufacturing environments. As a result, automation is becoming a core strategy for players aiming to maintain competitiveness and meet the rapidly evolving demands of emerging technologies.

Top of FormSemiconductor Assembly and Packaging Equipment Market Report Highlights

• In terms of packaging type, the bonding equipment segment held the largest revenue share in 2024, as it plays a major role in advancing semiconductor device miniaturization and performance.
• Based on end use, the OSAT segment is projected to grow the fastest, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.
• The North America semiconductor assembly and packaging equipment market is set for significant growth, supported by its focus on innovation and high-tech manufacturing capabilities.
• Asia Pacific led the global market in 2024, owing to its robust semiconductor ecosystem and heavy investments in next-gen packaging infrastructure.
• A few global key players in the semiconductor assembly and packaging equipment market include Applied Materials; ASM Pacific Technology; Besi; Disco Corporation; Kulicke & Soffa Industries, Inc. (K&S); Nikon Corporation; Plasma-Therm; Rudolph Technologies, Inc.; SCREEN Semiconductor Solutions Co., Ltd.; and SUSS MicroTec SE.

Polaris Market Research has segmented the semiconductor assembly and packaging equipment market report on the basis of product, packaging type, end use, and region:

By Product Outlook (Revenue, USD Billion, 2020–2034)

• Dicing Equipment
  • Scriber
  • Dicer
  • Wafer Mounting Equipment
• Bonding Equipment
  • Die Bonder
  • Wire Bonder
  • Others
• Packaging Equipment
  • Molding Equipment
  • Solder Plating Equipment
  • Deflasher
  • Others
• Others

By Packaging Type Outlook (Revenue, USD Billion, 2020–2034)

• Flip Chip Packaging Equipment
• Wafer Level Packaging (WLP) Equipment
• Fan-Out Packaging Equipment
• System-in-Package (SiP) Equipment
• 3D/2.5D Packaging Equipment
• Others

By End Use Outlook (Revenue, USD Billion, 2020–2034)

• IDMs (Integrated Device Manufacturers)
• OSAT (Outsourced Semiconductor Assembly and Test)

By Regional Outlook (Revenue, USD Billion, 2020–2034)

• North America
  • U.S.
  • Canada
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Russia
  • Netherlands
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Malaysia
  • Vietnam
  • Australia
  • Rest of Asia Pacific
• Latin America
  • Argentina
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • UAE
  • Saudi Arabia
  • Israel
  • South Africa
  • Rest of Middle East & Africa