U.S. Semiconductor Assembly and Packaging Equipment Market Size Worth USD 825.84 Million by 2034 | CAGR: 6.53%

The U.S. Semiconductor Assembly and Packaging Equipment market size is expected to reach USD 825.84 million by 2034, according to a new study by Polaris Market Research. The report “U.S. Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use; Market Forecast, 2025–2034” gives a detailed insight into current market dynamics and provides analysis on future market growth.

The surging demand for advanced packaging technologies is driving the U.S. semiconductor assembly and packaging equipment market, as it directly aligns with the industry's shift toward higher performance, miniaturized, and multifunctional devices. Emerging applications in artificial intelligence (AI), high-performance computing, and 5G require complex packaging formats such as 2.5D/3D integration, system-in-package (SiP), and fan-out wafer-level packaging (FOWLP). These innovations demand highly specialized equipment capable of handling increased interconnect densities, thermal management, and heterogeneous integration. The adoption of advanced packaging tools is becoming essential, fueling steady growth in equipment investments as U.S. manufacturers compete on performance and design innovation.

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Government initiatives and localization efforts are playing a major role in driving the U.S. semiconductor assembly and packaging equipment market. Public policy is increasingly focused on incentivizing local manufacturing and reducing dependence on foreign supply chains, with growing focus on strengthening domestic semiconductor capabilities. These efforts are promoting capital investments in state-of-the-art assembly and packaging infrastructure across the U.S., including equipment procurement and facility modernization.

Top of FormU.S. Semiconductor Assembly and Packaging Equipment Market Report Highlights

• In terms of product, the bonding equipment segment led in revenue share in 2024, owing to its critical function in enabling semiconductor device miniaturization and enhanced performance capabilities.
• Based on end use, the OSAT segment is projected to grow the fastest during the forecast period, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.
• In terms of packaging type, the wafer-level packaging (WLP) equipment segment held the largest revenue share in 2024, as its chip-scale integration approach offers improved electrical performance, space efficiency, and production cost advantages.
• A few key market players include Aehr Test Systems; Applied Materials; Brewer Science; Cohu, Inc.; KLA Corporation; Kulicke & Soffa Industries (K&S); Onto Innovation; Plasma-Therm; Rudolph Technologies, Inc.; and Veeco Instruments Inc.

Polaris Market Research has segmented the U.S. semiconductor assembly and packaging equipment market report on the basis of product, packaging type, and end use:

By Product Outlook (Revenue, USD Million, 2020–2034)

• Dicing Equipment
  • Scriber
  • Dicer
  • Wafer Mounting Equipment
• Bonding Equipment
  • Die Bonder
  • Wire Bonder
  • Others
• Packaging Equipment
  • Molding Equipment
  • Solder Plating Equipment
  • Deflasher
  • Others
• Others

By Packaging Type Outlook (Revenue, USD Million, 2020–2034)

• Flip Chip Packaging Equipment
• Wafer Level Packaging (WLP) Equipment
• Fan-Out Packaging Equipment
• System-in-Package (SiP) Equipment
• 3D/2.5D Packaging Equipment
• Others

By End Use Outlook (Revenue, USD Million, 2020–2034)

• IDMs (Integrated Device Manufacturers)
• OSAT (Outsourced Semiconductor Assembly and Test)